Advanced Packaging Analysis
TSMC's CoWoS (Chip on Wafer on Substrate) technology is the critical bottleneck for AI chip production, enabling the integration of multiple chiplets and HBM memory.
Key Metrics
Throughput = (Packaged units/week) constrained by CoWoS lines, bump/TSV steps, and test capacity
Constraint = min(ABF substrate supply, interposer capacity, packaging tool availability)
What matters in this layer
Advanced chiplets trade monolithic scaling for integration complexity. Dominance comes from proven process recipes, low defectivity across large interposers, and a supply chain that can expand without breaking yields.
Even with ample wafer starts, GPU shipments can bottleneck on CoWoS throughput. Expansions depend on equipment and qualified operators, not only capex.
Multi‑die packages multiply yield loss modes. Small defect improvements compound into large effective output gains, especially for large HBM‑heavy packages.
TSMC CoWoS Capacity Constrains AI Chip Supply
TSMC is aggressively expanding CoWoS capacity, but demand continues to outstrip supply. The company expects to double capacity by 2025.
Intel Advances Foveros 3D Packaging
Intel's Foveros technology enables face-to-face chip stacking, offering an alternative to TSMC's CoWoS for advanced AI chip integration.